Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures

How Novel SHJ Applications are Shaping the PV Market

Authors

DOI:

https://doi.org/10.52825/siliconpv.v2i.1305

Keywords:

Photovoltaics, Heterojunction, SHJ, Ag, Cu, AgCu, Nanoparticles, Metallization

Abstract

This work provides an overview on the different approaches to make Silicon Hetero-Junction cell (SHJ) production more scalable by investigating alternative metallization processes which can potentially be competitive with the standard Ag-based processes (Ag micro-size). With this purpose, this research aims at introducing the idea of widely using Ag-coated Cu formulations and/or low-Ag deposit solutions involving Ag nanoparticles-based formulations and reactive Ag (also referred as particle free) inks for both rear and front cell depositions on a single (finger and busbars) screen-printing process.

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References

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Published

2025-01-14

How to Cite

Frasson, N., & Galiazzo, M. (2025). Pushing Heterojunction Technology Further: Novel Metallization Processes and Architectures: How Novel SHJ Applications are Shaping the PV Market. SiliconPV Conference Proceedings, 2. https://doi.org/10.52825/siliconpv.v2i.1305

Conference Proceedings Volume

Section

Advanced Manufacturing, Challenges for Industrial Devices
Received 2024-04-26
Accepted 2024-10-02
Published 2025-01-14