Kaeppeler U, Schneller K, Wallburg F, Engisch L, Schönfelder S. Analysis of the Compression Behavior of Different Cardboard Materials During Embossing. Open Conf Proc [Internet]. 2022 Dec. 15 [cited 2024 Nov. 22];2:129-35. Available from: https://www.tib-op.org/ojs/index.php/ocp/article/view/132